ERSA

BGA Inspection, BGA Repair, & BGA Rework

In keeping with our philosophy of leading our industry in quality and excellence, we have dedicated an entire area to BGA inspection, X-Ray, and Rework.  Our BGA X-Ray and inspection equipment allows us to gain visual access under BGAs (Ball Grid Arrays) and QFPs (Quad Flat Packs).

With the ERSA technology our optics can magnify up to 300x power.  This allows us to focus on and see the interior ball contacts in the middle of a BGA package view the toe and heel of a QFP with ease. 

Our Glenbrook Technologies X-Ray equipment provides us the ability to inspect BGA solder ball contacts to verify quality.  We have the only system that is not subject to Voltage Blooming. This keeps any visible void sizes consistent at all voltages, providing reliable pass/fail data.  This is just another service in our quest for quality that we offer to ensure our customers’ satisfaction at Lectronics.

The Air-Vac Rework station provides computer controlled profiling for removal and replacement of BGAs or QFPs.