BOX BUILD ASSEMBLY

Capabilities

Saline Lectronics offers the latest technical capabilities to meet your most demanding project requirements for circuit board assemblies.  Whether we produce your product with BGA, Micro-BGA, Surface Mount or Through-Hole Technology, Lectronics works closely with you, the customer, to ensure that you are 100% satisfied. 

Our capabilities include multiple, linked continuous flow production lines, dedicated aqueous and no-clean solder chemistry, potting and conformal coating, and final product assembly (box builds). One of our special capabilities is New Product Introduction.

Whether your run is medium or small, our 40,000 square foot static-controlled production facility offers the technology to deliver timely assembly of mid- to high-complexity printed circuit boards, including prototype and production quantities.

Our Selective Solder system can solder component pitches down to 0.025 inches with no difficulty.  With our selective solder machine on board vision systems, keep out areas of <0.040” is possible.