BGA Placement, BGA Inspection, & BGA Rework
In keeping with our philosophy of leading our industry in quality and excellence, we have dedicated an entire area to BGA inspection, X-Ray, and Rework. Our BGA X-Ray and inspection equipment allows us to gain visual access under BGAs (Ball Grid Arrays) and the ‘heel’ fillets of the QFPs (Quad Flat Packs).
Saline Lectronics uses an X-ray process to inspect both the placement accuracy and solder quality of Ball Grid Arrays (BGAs) in the Printed Circuit Board (PCB) assembly process. We have experience with all types of BGAs including ceramic (CBGA), plastic (PBGA), micro BGAs, and QFNs, and bottom-termination SMT components.
Saline Lectronics uses only the best equipment for its BGA inspection process when we handle your manufacturing process. With ERSA technology, our optics can magnify up to 300x power, allowing for the verification of precise alignment of component connections. Please note, however, that the ERSA can only see under a BGA about 4 to 5 rows.
Our Yes-Tech Model YTX-3000 allows us to inspect BGA solder ball contacts to verify quality. This is achieved by capturing ‘gray scale’ images of the solder connection under the parts. The intensity and contrast can be varied to provide more accurate images. These images are used to interpret solder quality. We have the only system that is not subject to voltage blooming, which ensures that any visible void sizes remain consistent at all voltages, providing reliable pass/fail data.
Finally, the Air-Vac Rework station provides computer controlled profiling for removal and replacement of BGAs or QFPs should they not meet quality standards. We are equipped for both Tin/Lead (Sn/Pb) and Lead Free processes, depending on your need.
Are you ready to put Saline Lectronics to work for you? Access your immediate SMT PCB assembly quote.