Through Hole Technology

Through Hole TechnologyWhile we keep current with the latest manufacturing technologies, Saline Lectronics maintains the capability to manufacture printed circuit boards using Through-Hole Technology (THT) to support legacy PCB designs and assemblies.

Our capabilities include multiple, linked continuous flow production lines, dedicated aqueous and no-clean solder chemistry, potting and conformal coating, and final product assembly (box builds). Our test and inspection methodology is built into the assembly process, guaranteeing high quality boards. In addition to offering through hole assembly, we can locate parts and replacements to help you deal with end-of-life component issues.

We thrive on manufacturing highly complex designs and mixed technologies, including THT. Using selective soldering, we can work with through hole components without interfering with surface mount components. Our Selective Solder machine can solder pitches down to 0.025″. This allows us to solder components to the underside of boards without disrupting the topside.

Whether your run is medium or large, our 110,000 square foot static-controlled production facility offers the technology to deliver timely assembly of mid- to high-complexity printed circuit boards.

Are you ready to put Lectronics to work for you? Request a quote for through hole assembly services.