Whether your run is medium or small, our 40,000 square foot static-controlled PCB assembly facility offers the technology to deliver prompt assembly of mid- to high-complexity printed circuit boards, including prototype and production quantities.

Saline Lectronics provides the latest in SMT, THT, Micro-BGA, BGA rework and assembly capabilities, in addition to mixed technology assemblies. We offer surface mount placement down to 12mil pitch, with a component range of 0402 to 52mm square QFPs and BGAs. And to ensure the highest level of quality, we provide extensive BGA/Micros-BGA X-Ray, In-Circuit, Flying Probe and Functional testing.

Keeping up with the latest technology is our Selective Soldering System. Patented features in our equipment give it the ability to solder pads as small as .010 inches resulting in a tool-less system for almost any soldering application. This equipment specializes in troublesome through-hole components in SMT assemblies from the underside (connectors, power supplies, coils, relays, batteries and odd-forms.) Ideal for accessing sites inside of assembly cases or sites shadowed by obstructions.

Request a quote from Saline Lectronics for BGA rework, or PCB assembly and testing services.